BGA Layer by Layer Construction Analysis

Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Some devices are delayered to reveal the structure of internal layers. All lines and spaces are measured.

EDX spectrum of intermetallic formation

Internal layer of BGA package

Cross-section showing core and blind via

Measurements of critical dimensions on internal layer

Typical Applications
Quality documentation
Supplier evaluation
Non-conformance verification
Failure analysis
Reliability qualification
Technology cloning
Destructive Physical Analysis (DPA)
Intellectual property violation
Counterfeit detection

Techniques
X-Ray imaging
Acoustic microscopy
Electron microscopy with EDX
X-Ray Fluorescence (XRF) spectroscopy
Raman spectroscopy
FTIR spectroscopy
Confocal Laser Scanning Microscopy (CLSM)