BGA Layer by Layer Construction Analysis

Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Some devices are delayered to reveal the structure of internal layers. All lines and spaces are measured.

Typical Applications
Quality documentation
Supplier evaluation
Non-conformance verification
Failure analysis
Reliability qualification
Technology cloning
Destructive Physical Analysis (DPA)
Intellectual property violation
Counterfeit detection

X-Ray imaging
Acoustic microscopy
Electron microscopy with EDX
X-Ray Fluorescence (XRF) spectroscopy
Raman spectroscopy
FTIR spectroscopy
Confocal Laser Scanning Microscopy (CLSM)