BGA Layer by Layer Construction Analysis
Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Some devices are delayered to reveal the structure of internal layers. All lines and spaces are measured.
Destructive Physical Analysis (DPA)
Intellectual property violation
Electron microscopy with EDX
X-Ray Fluorescence (XRF) spectroscopy
Confocal Laser Scanning Microscopy (CLSM)