X-Ray Imaging
Real-time x-ray imaging is done in transmission and the image can be captured using film or an x-ray imaging system. The sample may be rotated to allow various perspectives, within the limitations of the sample size and geometry.
X-ray imaging is a quick, non-destructive analysis technique to look at solder joint quality and the large scale structure of devices.
Equipment
100kV x-ray imaging system upgraded to 1024x1024 pixel CMOS sensor
X-ray on film for military applications
3D x-ray available by special request
If defects are detected, recommendations are made for further tests or analyses.
![](https://muanalysis.com/wp-content/uploads/2019/01/322XRAYall.jpg)
Bond wires in stacked Si chipsBalls and bumps of fcBGA
![](https://muanalysis.com/wp-content/uploads/2019/01/322diode2side-60keV-2.jpg)
Semiconductor Diode
Typical applications
Failure analysis
Reverse engineering
Reliability analysis
Forensic analysis
Detection of:
Defects and voids in BGA balls, QFNs
Wire bonding defects
Metallization burnout
Voids in through hole pins.
Evaluation of:
Die attach integrity
Solder bump quality
Failure analysis
Reverse engineering
Reliability analysis
Forensic analysis
Detection of:
Defects and voids in BGA balls, QFNs
Wire bonding defects
Metallization burnout
Voids in through hole pins.
Evaluation of:
Die attach integrity
Solder bump quality