Shear Test, Bend Test and Tensile Test
Shear testing and pull testing are parts of Destructive Physical Analysis (DPA) for passive or active electronic components and cable assemblies. They evaluate the strength of solder joints or leads against tugging or pushing. Pull tests are done in tension and shear tests in compression. Other materials such as paper, plastic films and metal wire are submitted to tensile tests to verify their elasticity. Bend tests are performed on printed circuit boards to assess the resistance of capacitors to cracking.
MIL-STD-883 method 2019 Die shear
MIL-STD-883 method 2011 Bond wire pull
AEC Q-200 Method 005 Board Flex Test
AEC Q-200 Method 006 Passive Component Terminal Strength Shear Test
MIL-STD-750 Method 2036 Terminal Strength
MIL-STD-883 method 2004 lead Integrity