BGA Layer by Layer Construction Analysis
Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Some devices are delayered to reveal the structure of internal layers. All lines and spaces are measured.
Destructive Physical Analysis (DPA)
Intellectual property violation
Techniques X-Ray imaging Acoustic microscopy Electron microscopy with EDX X-Ray Fluorescence (XRF) spectroscopy Raman spectroscopy FTIR spectroscopy Confocal Laser Scanning Microscopy (CLSM)