Teardown Analysis
When you have to know what makes it tick.
Teardown analysis comprises a set of techniques for examining devices and materials at the smallest constituent level.The result is a comprehensive report presenting our thorough analysis of the construction and materials of a device as examined from all angles.
At MuAnalysis we also routinely acquire and tear down interesting new products, then offer reports of our findings which can be found in our publications section.
Confidential claim charts and expert witness reports are also available.
Typical applications
• Root-cause Failure Analysis
• Technology evaluation
• Supplier qualification
• Quality documentation
• Non-conformance verification
• Reliability qualification
• Technology cloning
• Destructive Physical Analysis (DPA) per MIL-STD-750
• Intellectual property violation
• Trademark violation
• Counterfeit detection
• Root-cause Failure Analysis
• Technology evaluation
• Supplier qualification
• Quality documentation
• Non-conformance verification
• Reliability qualification
• Technology cloning
• Destructive Physical Analysis (DPA) per MIL-STD-750
• Intellectual property violation
• Trademark violation
• Counterfeit detection