Temperature Cycling & Temperature Shock

Temperature cycling and temperature shock are used to determine the resistance of parts to sudden exposure to extreme changes of temperature. Electrical measurements can be done while parts are held at low or high temperature to evaluate the effect of temperature on circuit performance. Alternating high and low temperature extremes induces mechanical stresses in electronic components and/or solder joints.

Typical applications Reliability testing according to: MIL-STD-883 MIL-STD-750 Jedec JESD22-A104-B Jedec JESD22-A106-A Other standards Pre-assembly verification of electrical specifications at any temperature Techniques Air-to-air shock Liquid-to-liquid shock Slow temperature cycling Reflow oven Acoustic microscopy Electrical characterization